Engineering Capabilities

DAT
Electronics

DAT Electronics

Cairo, Egypt

datelectronics.com

Full-stack electronics engineering from first sketch to mass production. PCB design, embedded firmware, DFM, validation, and manufacturing — one team, one source of truth.

01 — Design

PCB Design

—Up to 16-layer rigid, rigid-flex, and flex stackups
—Controlled impedance (single-ended and differential)
—HDI, blind/buried via, via-in-pad
—RF and antenna layout (Wi-Fi, BT, Cellular, LoRa)
—High-current power electronics
—Mixed-signal and high-speed digital (DDR4, PCIe, USB 3.x, MIPI)
—Thermal design and simulation
—IPC 6012 Class 2 / Class 3 certified outputs

02 — Firmware

Embedded Software

—Bare-metal C / C++ on STM32, NXP i.MX, Nordic, Espressif, TI Sitara
—FreeRTOS and Zephyr RTOS
—Linux BSP development (Yocto, Buildroot)
—Mainline Linux kernel contributions and patches
—Secure boot, signed firmware, OTA update pipelines
—USB, Ethernet, CAN, RS-485, Modbus, EtherCAT stacks
—Motor control (FOC, stepper, BLDC)
—Wireless protocol implementation (Matter, BLE, Thread)

03 — Validate

Validation & Certification

—EMC pre-compliance (near-field scanning, emissions, immunity)
—Chamber pre-scan and lab coordination
—CE, FCC, IC certification project management
—HALT / HASS environmental testing
—ATE fixture design and ICT coordination
—Functional test plan development
—Electrical safety (IEC 60950, IEC 62368)
—First-article inspection and golden-unit test libraries

04 — Manufacture

Manufacturing

—CM selection, qualification, and audit
—NPI — process documentation, PFMEA, control plans
—DFM / DFA review (early and final)
—DFT — testability review and bed-of-nails planning
—Stencil, panelisation, and reflow profile optimisation
—Yield ramp monitoring and SPC
—Supply chain risk assessment and alternate sourcing
—Build-to-print and turnkey manufacturing management

[T]Technical specifications

Design tools

Altium Designer, KiCad

Firmware tools

STM32CubeIDE, Zephyr SDK, Yocto, IAR

Simulation

LTspice, HyperLynx (signal integrity)

Layer count

2 – 16 layers (standard), up to 20 (specialist)

Min trace / space

0.075 mm / 0.075 mm (HDI)

Controlled impedance

±10% (standard), ±5% (precision)

Via types

Through-hole, blind, buried, via-in-pad (filled & capped)

Surface finish

ENIG, HASL, OSP, immersion Ag/Sn

Silkscreen

LPI, inkjet — min text 0.8 mm

Assembly

SMT + THT, mixed technology, selective solder

Component size

01005 and above (0402 preferred production min)

Testing

Flying probe, ICT, functional ATE, JTAG/SWD boundary scan

Quality standard

IPC-A-610 Class 2 / Class 3, IPC 6012

NDA

Mutual NDA before first technical call — standard practice

Start with a brief.